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| MF359 780nm - 55MHz High Performance LED www..com Data Sheet August 2003 Ordering Information MF359 MF359 ST MF359 SMA TO-46 Package ST Housing SMA Housing -40C to +85C Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less. Features * * * * 780nm Surface-Emitting LED 55MHz Bandwidth Designed for 62.5/125m fiber Low thermal droop Description The low thermal droop of this device allows baseband video transmission with minimum distortion. The double-lens optical system provides for optimum coupling of power into the fiber. It matches with the MF446 PIN Photodiode. Applications * * * Baseband Video Sensors General Purpose CASE ANODE CATHODE ANODE CATHODE Bottom View Figure 1 - Pin Diagram Figure 2 - Functional Schematic 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2003, Zarlink Semiconductor Inc. All Rights Reserved. MF359 Optical and Electrical Characteristics - Case Temperature 25C Parameter Fiber-Coupled Power Rise and Fall Time (10-90%) Bandwidth (3dBel) Thermal Droop (non linearity) (Note 2) Peak Wavelength Spectral Width (FWHM) Forward Voltage (Figure 7) Reverse Current Capacitance Note 1: Note 2: Data Sheet www..com Symbol Pfiber tr,tf fc IPI p VF IR C Min 80 Typ 120 6 55 2 Max Unit W Test Condition IF=80mA (Note 1) IF=80mA (no bias) IF=80mA IF=80mA IF=80mA IF=80mA IF=80mA VR=1V VR-0V, f=1MHz Fiber: 62.5/ 125m Graded Index NA=0.275 8 ns MHz % 760 780 50 2.2 250 800 2.6 20 nm nm V A pF Measured at the exit of 100 meters of fiber. Transient decline in optical power due to self-heating. Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature (derating: Figure 6) Electrical Power Dissipation (derating: Figure 6) Continuous Forward Current (f<10kHz) Peak Forward Current (duty cycle<50%,f>1MHz Reverse Voltage Soldering Temperature (2mm from the case for 10 sec.) Symbol Tstg Top Ptot IF IFRM VR Tsld Limit -55 to +125C -40 to +85C 300 mW 110 mA 180 mA 1.5 V 260C Thermal Characteristics Parameter Thermal Resistance - Infinite Heat Sink Thermal Resistance - No Heat Sink Temperature Coefficient - Optical Power Temperature Coefficient - Wavelength Symbol Rthjc Rthja dP/dTj d/dTj -0.5 0.3 Min Typ Max 100 400 Unit C/W C/W %/C nm/C 2 Zarlink Semiconductor Inc. MF359 Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numerical Aperture 50/125m 0.20 60W 62.5/125m 0.275 120W 100/140m 0.29 250W Data Sheet www..com 200/230m 0.37 400W 100 r Relative Fiber-coupled Power (%) z 80 r - optimal OC = 62.5 m 60 40 20 0 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 z - Axial Displacem ent of Fiber (m m ) Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber 3 Zarlink Semiconductor Inc. MF359 Data Sheet www..com 100 r Relative Fiber-coupled Power (%) 80 z z - optimal OC = 62.5 m 60 40 20 0 0 10 20 30 40 50 60 70 80 90 100 r - Radial Displacem ent of Fiber ( m ) Figure 4 - Relative Fiber-coupled Power vs. r - Radial Displacement of Fiber 100 Relative Fiber-coupled Power (%) 80 60 50% Duty Cycle 40 DC 20 Heat Sinked 0 0 20 40 60 80 100 120 140 160 180 200 Forw ard Current (mA) Figure 5 - Relative Fiber-coupled Power vs. Forward Current 4 Zarlink Semiconductor Inc. MF359 Data Sheet www..com 300 Max. Electrical Power Dissipation (mW) 250 200 150 No Heat Sink 100 Inf inite Heat Sink 50 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Operating Tem perature ( oC) Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature 200 175 150 Forward Current (mA) 125 100 75 50 25 0 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 Forw ard Voltage (V) Figure 7 - Forward Current vs. Forward Voltage 5 Zarlink Semiconductor Inc. www..com BOTTOM VIEW ( 10 : 1 ) 3,8 2,54 0,6 n1,17 + 0,05 (3x) n0,45 + 0,03 (3x) - SIDE VIEW 13,460,76 0 0,04 45 R2,7 R0,2 max (4x) 3, 6 1, 0 2 0, 3 Lens n1.50.05 R0,4 max NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 m. Header: Ni 2-3 m / Au min 1,32 m. n4,7 0,3 max glass overmould (2x) (c) Zarlink Semiconductor 2002. All rights reserved. Package code Previous package codes Drawing type ISSUE ACN DATE 1 JS004 076R1 A TB Package drawing, TO-46 with lens Title 22-MAR-03 APPRD. TD/BE JS004076 www..com For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request. Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE |
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